Silicon Carbide Grinding Equipment: The Pillar of Precision Manufacturing

In the field of modern high-tech manufacturing, silicon carbide (SiC), as an important inorganic compound, has attracted much attention due to its unique physical and chemical properties. SiC has the characteristics of high hardness, wear resistance, high temperature resistance, high frequency, high pressure and low energy consumption, and is widely used in many fields such as microelectronics, aerospace, medical equipment and high-power LED. However, to fully tap the potential of SiC materials, high-precision and high-efficiency Silicon carbide grinding equipment is indispensable.

The working principle of SiC grinding equipment mainly includes steps such as loading wafers, grinding, polishing, cleaning and drying, and wafer transmission. The SiC wafer to be processed is loaded onto the clamping device of the equipment to ensure that the wafer maintains a stable position and posture during the processing. By rotating the disc or grinding head, the grinding sheet or grinding liquid is brought into contact with the surface of the wafer, and the mechanical friction and chemical corrosion of the abrasive particles are used to remove the irregular parts and oxide layer on the surface of the wafer.

On the basis of grinding, the surface of the wafer is further polished to eliminate scratches and tiny pits generated during the grinding process, making the surface of the wafer smoother and flatter. After the polishing process is completed, the surface of the wafer is cleaned and dried using a cleaning unit to remove residual grinding fluid and particulate contaminants to ensure the cleanliness of the wafer surface.

The technical characteristics of SiC grinding equipment are mainly reflected in high-precision processing, high-efficiency production, and environmental protection and energy saving. With the continuous reduction of integrated circuit process nodes, the requirements for wafer surface quality are also getting higher and higher, requiring SiC grinding equipment to have higher processing accuracy and stability. In order to improve production efficiency and reduce production costs, SiC grinding equipment needs to achieve more efficient processing speeds and larger production batches. With the improvement of environmental awareness and the tension of energy resources, SiC grinding equipment needs to pay more attention to environmental protection and energy-saving design to reduce the generation of waste and energy consumption.

SiC grinding equipment has a wide range of applications in the field of semiconductor manufacturing, especially in high-tech fields such as chip manufacturing, optical components, and LED chips. It plays a vital role. SiC's high transparency bandgap and physical properties make it an ideal material for manufacturing high-power LEDs, laser diodes, photodetectors, solar cells, and UV recorders.

With the rapid penetration of SiC materials in electric vehicles, industrial applications, and 5G communications, the market size of SiC power devices is expected to grow significantly. According to Yole, a semiconductor research and consulting company, by 2028, the market size of SiC power devices will reach nearly US$9 billion, of which automotive and industrial applications are the main downstream application structures, accounting for 74% and 14% respectively. This trend will drive the continued growth of demand for SiC grinding equipment.